Technical Information

Timeline to Delivery

Step 1

Contact Us for a Consultation

Please inquire using the Contact Us page. We will confirm the details and contact you.
Step 2

Confirmation of the Data

Please provide us with the design files using any of the formats listed below.
Step 3

Proposal and Cost Estimate

Once we confirm the design specifications, we will submit a proposal along with the cost estimate. We will begin the prototyping process once the customer approves the proposal.
Step 4

Microfluidic Chip Delivery

2D Data
- ・DXF(.dxf)
- ・DWG(.dwg)
3D Data
- ・IGES (.igs)
- ・STEP (.stp)
- ・Parasolid (.x_t)
Handwritten Data

We can prepare the technology drawings for you. Please contact us to discuss this further.
Separate fees may apply for this service.

	Maximum size	148mm×98mm
	Thickness	1,2,3,4,5,6,10mm

	Minimum channel width	50μm±15μm
	Maximum channel depth	(2 x width)

Deburring with ultrasonic cleaner

Ra: 0.03 - 0.3μm (Carbide end mill)

Diamond end mill can achieve lower surface roughness, however carbide end mill is required to achieve minimum channel width of 50μm

Zeon’s bonding withstand the pump pressure of 500kPa under the following conditions

Chip Size	70mm×15mm
Channel Profile	Width	5mm
	Depth	0.2mm
	Length	60mm
Plate Thickness	Upper plate	2mm
Plate Thickness	Lower plate	2mm
Test Liquid	Distilled water (food coloring agent)
Pump	P-Pump (Dolomite)

Chip Size
70mm×15mm
Channel Profile
Width	5mm
Depth	0.2mm
Length	60mm
Plate Thickness
Upper plate	2mm
Lower plate	2mm
Test Liquid
Distilled water (food coloring agent)
Pump
P-Pump (Dolomite)

Learn more about COP